机译:分层化学键有助于α-MgAgSb热电材料的固有低热导率
Zhejiang Univ, Dept Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Zhejiang, Peoples R China;
Shanghai Univ, Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China;
Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, 1295 Dingxi Rd, Shanghai 200050, Peoples R China;
Shanghai Univ, Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China;
Zhejiang Univ, Dept Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Zhejiang, Peoples R China;
Shanghai Univ, Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China;
Zhejiang Univ, Dept Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Zhejiang, Peoples R China;
Zhejiang Univ, Dept Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Zhejiang, Peoples R China;
机译:塔拉赫石Cu_(17.6)Fe_(17.6)S_(32)热电材料中固有的低导热系数的起源:晶格动力学与热传输之间的关系
机译:Talnakhite Cu_(17.6)Fe_(17.6)S_(32)热电材料中固有低导热率的起源:格子动力学和热运输之间的相关性
机译:具有化学键层级的热电材料的热传输
机译:Cubbbiq_3的立方体家族的热电性能(Q化学界S,SE,TE)。极低的导热率材料
机译:适用于高级热电应用的低导热率材料。
机译:适用于大块热电材料的低导热率(MS)1 + x(TiS2)2(M = PbBiSn)不匹配层化合物
机译:Heal-heusler复合碧皮克的高热电性能,具有本质上的晶格导热率
机译:制定降低低温热电材料导热系数的研究计划