AN EVALUATION OF THE PARTIAL TRANSIENT LIQUID PHASE BONDING OF Si_3N_4 USING Au COATED Ni-22Cr FOILS

摘要

The application of the partial transient liquid phase bonding (PTLPB) process for joining silicon nitride ceramics using microdesigned Au/Ni-Cr/Au multilayer interlayers has been investigated. The influence of different bonding parameters, such as time, temperature and interlayer thickness, on the microstructure and chemistry of the ceramic-metal interfaces has been studied. Scanning electron microscopy and electron probe microanalysis investigations revealed that the ceramics were bonded to the Ni-Cr foils by a thin CrN reaction product layer while the Au had alloyed to form a Ni rich solid solution.