Silicon nitride-nickel joints through diffusion bonding

摘要

Diffusion bonding of Si_3N_4 to Ni under low vacuum conditions was studied. The joint inter- faces were analysed in terms of microstructure, elemental diffusion, chemical reactions and mechanical properties. The mechanisms involved in the bonding process were investigated and related to the characteristics of the starting material, to the adopted experimental conditions and to the joint fracture strength. Interdiffusion and intrinsic diffusion coefficients of the elements involved (Ni,Si) in the diffu- sion process and the relative activation energies were calculated.