The value of unpowered thermal cycling as a stress screening process for electronic hardware

摘要

A recent survey of field failures in military electronic hardware indicates that approximately 80% of failures are due to thermal cycling and 20% are due to vibration [Ref.1]. Examination of these failures reveals failure mechanisms which fall into the category of cumulative fatigue. Typical of these failure mechanisms, but not exhaustive, are open circuit connectors, fractured solder joints, cracked hermetic seals, fractured plated through holes, broken electrical wires, broken component leads, adhesive joint failure, component wire bond failure and component die cracking.