电子设备封装残余应力分析及测量技术

摘要

A 3D Calculating model of power package of ceramic-metal is proposed to analyze the residual stress of packaging by finite element program in this paper, and using the method of Raman Spectrum and X Radial to test the residual Stress of Printed Circuit Board, By this Way, The formation of a complete set of residual stress analysis and measurement technology of the Packaging Printed Circuit Board, The results are expected to act as database for improving reliability evaluation and optimizing design of packaging.%采用有限元方法对陶瓷-金属钎焊封装管壳的残余应力进行仿真计算,并采用拉曼光谱方法和X射线方法对其残余应力进行测量,计算和试验吻合较好.通过仿真分析和测量手段,形成了一套较为完备的电子设备封装残余应力分析及测量技术,对管壳封装结构的可靠性评估和优化设计具有重要的指导意义.