电流密度对氨基磺酸镍电镀镍镀层的影响

摘要

In order to understand the effect of the different current density on the amino acid nickel, the appearance, hardness, stress and deposition rate of the nickel coating of nickel sulfamate were analyzed and the conclusion that current density was indirect ratio to deposition rate obtained at the current density 0. 1 A/dm^2 - 20A/dm^2. In the range of technology, when the current density increased, the deposition rate increased, the coating hardness decreased, the porosity became larger, the surface had pinhole defects and the stress became large. Then discussed the reasons for the above situations.%为了解不同电流密度对氨基磺酸镍镀层的影响．分析了电流密度在0．1～20A／dm。时，氨基磺酸镍镀镍层的外观、硬度、应力和沉积速率。在工艺范围内，随电流密度的增加沉积速率增加、镀层硬度降低、孔隙率变大、表面出现针孔缺陷、应力变大，随后讨论了出现各种情况的原因.