S波段高功率T/R组件的小型化和高可靠设计

摘要

介绍了一种S波段高功率T/R组件的小型化和高可靠设计技术。组件整体采用了一种＂三明治＂式电路结构形式,并使用多层微波复合介质基板完成高密度互连,使用集成双管功放单元和层压串馈功率合成器技术制作高功率密度功放电路。结果表明,用该技术方法研制的S波段高功率T/R组件输出功率可达800 W,重量约3 kg,长期工作稳定可靠。%The technology of the miniaturization and high reliability for an S-band high-power T/R module is introduced. The sandwich-type circuit structure is adopted for the overall module, and the multilayer microwave composite substrate is used to realize the high density interconnection. Besides, the technologies of the double-tube integrated PA unit and the laminated crossfeed power synthesizer are used to make the high-power density PA circuit. The test results show that the S- band high-power T/R module developed through the method above is stable and reliable with the output power up to 800W and the weight about 3kg.