形变时效对Cu-1.3Ni-0.3Si合金力学性能及导电率的影响

摘要

采用OM、SEM和EDS等分别研究了400～550℃、1～8 h时效工艺对冷轧变形程度为o～70％的Cu-1.3Ni-0.3Si合金显微组织及性能的影响.结果表明,经不同冷变形量的合金在450℃时效1h后,硬度均到达峰值,当温度升高到500℃时,合金导电率达到最大值,此时基体组织中分布有大量细小弥散的第二相颗粒;合金的导电率随保温时间的延长不断增大,且变形程度越大,导电率提升越明显.预冷变形量为70％的合金在450℃×3h时效后,其硬度达到180HB,导电率可达52％IACS,相比未经变形合金时效后最高硬度提高了约21％,导电率提高了约11％.%Effect of aging process with 400～550 ℃ for 1～8 h on microstructure and properties of Cu1.3Ni-0.3Si alloy with 0～70％ cold deformation was investigated by OM,SEM and EDS.The results show that hardness of alloy with different cold deformation reaches the peak value after aging at 450 ℃ for 1 h.Upon temperature rising to 500 ℃,the electrical conductivity of alloy reaches the maximum value,with a large number of fine dispersed second phase particles in the matrix structure.Conductivity of alloy rises constantly with extension of holding time.The greater degree of deformation is,the more obvious alloy conductivity rises.Hardness of alloy with 70％ pre-cooling deformation after aging at 450 ℃ for 3 h is 180HB and conductivity is 52％IACS.Compared to untreated alloy,the maximum hardness of alloy after aging rises by about 21％,and electrical conductivity rises by about 11％.