平行缝焊金属封装内部多气氛控制研究

摘要

With the rapid development of microelectronics technology,some standard or high reliable products’require-ments control of the internal water vapor electronic packaging hase improved,and the control is proposed for a variety of other atmosphere with the sealed harsh requirements,but due to the limitation of material and process,a variety of the sealed the atmosphere contains water vapor control has been the key and difficult point for highly reliable package.The in-ternal atmosphere causes analysis and treatment measures,the analysis of the thick film hybrid integrated circuit is given with a variety of atmosphere control scheme,in order to meet the level H especially space highly reliable products for elec-tronic packaging water vapor in atmosphere and a variety of other high control requirements.%随着微电子技术的飞速发展，部分军标或高可靠产品除了对电子封装内部水汽的控制要求有了大幅提升外，还对封装内部其他多种气氛的控制提出了严格的要求。由于受材料和工艺的限制，封装内部多种气氛含水汽的控制一直是高可靠封装的重点和难点。从内部气氛产生的原因分析及处理措施出发，分析给出了厚膜混合集成电路平行缝焊金属封装内部多种气氛控制方案，以满足 H 级产品特别是航天高可靠产品对电子封装内部水汽及其他多种气氛高标准的控制要求。