集成电路芯片合金烧结工艺 FMEA 应用分析

摘要

The reliability of IC is the basis for stable and reliable electronics systems.With the increasing requirements for reliability and service life of weapon electronics systems,the higher quality and reliability as well as storage life of integrated circuits are required.The analysis is conducted for IC chip alloy sintering process FMEA application,the factors affecting IC chip quality are identified to effectively improve the quality of the alloy sintering process,eliminate defects and obtain the high serviceability products.%集成电路的可靠性是电子系统稳定可靠工作的基础，随着武器装备电子系统对可靠性及使用期的要求不断提高，对于集成电路的质量和可靠性以及贮存寿命期提出了更高要求。通过开展集成电路芯片合金烧结工艺 FMEA 应用分析，找出合金烧结芯片影响集成电路质量的因素，有效提高了芯片合金烧结工艺质量，消除缺陷，获得高使用可靠性的产品。