银合金键合线IMC的实验检查方法研究

摘要

The intermetallic compound (IMC) which formed between aluminum pad and silver alloy bonding wire on the application of the encapsulation WB process is mainly introduced in this paper, and presented the impact of erosion on IMC. Due to the silver alloy wire IMC cannot be confirmed by physical methods,in this paper calculated the IMC coverage by software measurement and the chemical corrosion test. This paper details about the silver alloy wire IMC coverage how to accurately judgment and monitoring on encapsulation bonding process,in order to avoid poorly bonding resulted reliability problems or hidden quality issue.%介绍了封装键合过程中应用的银合金键合线与铝垫之间形成的共金化合物(IMC),提出了侵蚀对IMC的影响,由于银合金线IMC不能通过物理方法确认,需通过软件测量计算和化学腐蚀试验得到IMC覆盖面积.详述了银合金线IMC的结合面积在封装键合过程中如何准确地判定并监控,避免因键合不良造成的可靠性隐患或潜在质量问题.