等离子清洗在LED封装工艺中的应用

摘要

Process in the LED package,the device surface oxides and particulate pollutants will reduce product reliability,affect product quality.If the package before the plasma cleaning,you can effectively remove the contaminants.Introduced the principle of plasma cleaning equipment,and the effect of cleaning was compared before and after.%在LED封装工艺过程中,器件表面的氧化物及颗粒污染物会降低产品可靠性,影响产品质量。如在封装前进行等离子清洗,则可有效去除上述污染物。介绍了等离子清洗设备原理,并对清洗前后的效果做了对比。