模流分析在电子产品模具设计中的应用

摘要

The application of Moldex 3D software in the electronics mould design was introduced, with a vehicle-mounted GPS front cover as example. The procedure and related content of using the software for moldflow analysis were stated, focusing on analyzing the location of the injection point, encapsulation and weld lines position, pressure and temperature distribution, etc. The best gating scheme was determined by comparing with the two different gating methods, then the front cover mould design was completed , and this achieved good results.%以车载GPS的上盖为研究对象,介绍了Moldex 3D软件在电子产品模具设计中的应用,叙述了利用该软件进行模流分析的流程和相关内容,重点分析了进浇点的位置、包封及熔接痕的位置、压力及温度分布等,并通过两种不同进浇方式的比较,确定最佳的进浇方式,完成了上盖模具的设计,取得了很好的效果.