RTM工艺用室温可固化环氧树脂体系性能研究

摘要

选取了三种低黏度且可以室温固化的环氧树脂体系：QC350A／B，1564／HY3487，EV6620／HVC188，表征了树脂体系的流变性能、室温固化固化度及固化物弯曲性能。结果表明：三种环氧树脂体系在20～50℃有适于树脂传递模塑(RTM)工艺的低黏度操作平台；室温固化2周内固化度可达到90%，可以完成室温固化；室温固化21 d弯曲强度与高温后处理试样相当，弯曲弹性模量优于高温后处理试样，室温固化能够满足使用性能要求。%Three room temperature-curable epoxy candidate resins with low viscosity:QC350A/B,1564/HY3487,EV6620/HVC188 were characterized for rheological properties,degree of cure for different time in room temperature and room temperature cured flexural properties. The results indicate that three epoxy resins exhibite a long-term stable resin transfer moulding operating platform in 20-50℃. The degree of cure reach 90%after been cured at room temperature for different elapsed times. The flexural strength of samples cured at room temperature for twenty-one days is comparable to the samples cured at higher temperature. The flexural modulus of samples cured at room temperature for twenty-one days is superior to the samples cured at higher temperature. So the mechanical properties of candidate resins cured at room temperature met the requirements when used as structural parts.