有铅焊料焊接无铅BGA回流参数探索

摘要

航天电子产品尚未允许采用无铅焊接,而航天电子产品中采用的进口元器件多为无铅器件,因此需要对有铅焊料焊接无铅元器件进行研究。通过对无铅焊球和有铅焊料的焊接特性分析,设计数种回流参数,进行回流焊接试验,并对试验结果进行焊接分析,得出回流峰值温度为228℃~232℃,液相线（217℃）以上时间为50s~60s的回流曲线能较好完成有铅焊料对无铅BGA的焊接。%It is necessary to do some research on lead-free BGA soldering with Sn-Pb solder paste that most of the imported components used in aerospace electrical products are Pb-free while lead-free soldering is not yet allowed in aerospace electrical production.Several kinds of reflow parameter were designed after analyzing the feature of the lead-free solder ball and the Sn-Pb solder paste.Some Pb and Pb-free combined reflow experiments were made to test the designed reflow parameter.The analysis of the experiment solder joint indicated that a reflow parameter setting which can assure 228~232 peak reflow temperature and 50 s~60 s reflow time（217） can provide a good Pb and Pb-free combined BGA solder joint.