电子封装与微组装密封技术发展

摘要

Electronic packaging and micro-assembly technologies have entered into a developing period recently. New forms of packaging and micro-assembly are continuously emerging. But a difficulty has cropped up at standardization, leading to ambiguous concept. It will affect development of the technology. By integrating the annotation and feature of electronic packaging and micro-assembly, give out some advices and opinions, in order to promote development of microelectronics technology.%近年来,电子封装和微组装技术进入了超高速发展时期,新的封装和组装形式不断涌现,而其标准化工作已经严重滞后,导致概念上的模糊,这必然会对该技术的发展造成影响.力求将具有电子行业特点的电子封装和微组装密封的内涵和特点加以诠释,并对其发展提出见解和建议,以促进该技术的发展.