超薄硅片贴膜抛光技术研究

摘要

As IC chips become increasingly lighter, high quality of ultrathin polished wafers are demanded. Introduce a convenient method for affixing protective tape on the backside of the wafer manually, and apply it in 200 μm thickness of 7.6 cm epi-ready silicon wafer polishing process. Compare to the polishing process with wax, using tape is more practical, higher finished product ratio and lower cost.%伴随着集成电路芯片的不断轻薄化,各种高质量的超薄抛光片衬底需求日益增加.介绍了一种简捷、方便的手动贴膜方法,并将其应用在200μm厚7.6 cm硅单晶免清洗单面抛光片加工过程中,通过与粘蜡抛光相比较,发现贴膜抛光实用性更强、成品率更高且成本更低.