BGA has been widely used in varies domain. Briefly introduce BGA. Analyze the reason of voids production after giving the criteria of good BGA solder. Then elaborate the affection of voids on solder reliability. Finally, put forward measures for improving the voids.% BGA器件已经广泛应用于各个领域,首先对BGA器件进行了简介,在给出其焊点质量检验合格判据后,针对BGA组装过程中常见现象空洞,分析了空洞产生的机理,并进一步说明空洞对焊点可靠性的影响。最后根据空洞产生机理提出了一些措施以减少和改善空洞。
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