The contact angle is an important parameter quantifying the wettability of a solid surface by a liquid. The contact angles of the solder, the flux, the solder pad and solder mask plays an important role in welding procedure in electronic manufacturing. The methods available for droplet contact angle measurement though image processing is not accuracy enough. To deal with this problem, propose a novel contact angle measurement method based on the Young-Laplace equation. This method uses the observed height and volume of a droplet for the contact angle evaluation. Experiments show that the proposed method outperforms traditional methods in measurement accuracy. Furthermore, this method significantly reduces the effects of gravity, droplet volume, and light reflection interference on the measurement results.%接触角是表征液体与固体润湿程度的重要度量参数,焊料、焊剂、焊盘及阻焊层的接触角与电子制造焊接工艺密切相关。针对目前基于图像测量接触角的精度还不够高的现状,提出运用Young-Laplace方程的物理原理作为图像处理的方法,基于液滴润湿形态图像处理体积并捕获顶点坐标作为拟合参数,获得良好的接触角测量精度,显著减小了重力、液滴体积和光反射干扰对测量结果的影响。
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