LTCC基板砂轮划片工艺研究

摘要

The main factors of collapse on LTCC substrate back side in dicing were recognised by using orthogonal experiment method. Based on the analysis results of the main factors, the plan for LTCC substrate dicing was optimized, by which the collapse problem was solved. High quality LTCC Substrate dicing was achieved at last.%通过正交试验确认了导致LTCC（低温共烧陶瓷）基板砂轮划片背面崩边的主要因素，基于对各个主要因素的分析，优化了砂轮划片方案，有效地解决了背面崩边问题，获得了高质量的划片效果。