军用光电仪器电气元器件的拆焊工艺

摘要

During adjusting process, routinely experiment or examination of the product, sometimes it is needed to replace or desolder the component on the already soldered circuit board. It’s easy to damage the component which is desoldered or the surrounding component, even result in solder pad peeling and circuit board scrap. Discuss the process of desoldering component and cleaning solder pad, improve the process, and put forward a new desolder method. After the high and low temperature tests, vibration test of actual equipment, it’s veriifed that this desolder technology is effective and reliable for the desoldered component and the PCB.%在产品调试、例行试验或检验过程中有时不可避免地需要对电路板上已焊好的元器件进行更换拆焊，在拆焊过程中容易造成被拆元器件以及周围元器件损坏，甚至焊盘脱落和电路板报废。通过分析整个电气元器件拆焊工艺流程，改进容易造成损伤的电气元器件拆除和清理焊盘工序，并经过实际产品高低温试验和振动试验验证，证明该工艺方法能有效降低被拆元器件及其周围元器件和印制板的损伤，保证了电路板返修后的可靠性。