微波功率芯片真空焊接工艺研究

摘要

使用真空焊接技术焊接微波功率芯片可以降低焊接空洞率和提高焊接可靠性。微波功率芯片由于其表面存在空气桥，增加了焊接夹具的设计与制作难度，同时也增加了生产过程中的操作难度，因而研究微波芯片的真空焊接很有意义。阐述了采用金锡共晶焊料真空焊接微波功率芯片的相关问题，重点介绍了真空焊接原理和真空焊接工艺设计，根据实验结果总结和分析了影响焊接质量的因素。%Low voids and high reliability can be realized in microwave power die soldering with vacuum soldering technique. Because of air bridge on the surface of microwave power die, it is more difficult to design and manufacture the soldering tool, in the meanwhile, it is also more difficult to use the soldering tool, so it is useful to research the vacuum soldering technology of microwave power die. The concerned contents of microwave power die vacuum soldering with AuSn eutectic solder are described, including process of vacuum soldering, theory of vacuum soldering and influencing factors of vacuum soldering.