BGA返修芯片批量植球机关键技术研究

摘要

介绍了四种常见BGA植球方法.研究了真空植球法关键技术,包括针转写印刷、焊锡球移植和翻转预埋供球方式.针对芯片BGA返修批量植球,制作专门芯片承载托盘进行植球,研究并阐述了植球机具体工艺流程.最后在自主研制的半自动BGA返修芯片批量植球机MBA-1100上进行植球实验,在三次元影像仪FV-4030上观察植球并调整设备参数,取得了比较理想的植球效果.%Four kinds of BGA package are introduced, especially the key techniques of vacuum sucking method, it includes Pin-transfer, vacuum sucking method and pre-buried method for ball supply. In view of BGA chips rework mass production, a special support jig is designed to place chips, and the ball mounting technical process route is discussed. Finally, experiment on the semi-auto ball mounter MBA-1100 shows that it can realize the alignment of printing and ball mounting.