SiP组件中芯片失效机理与失效分析

摘要

Failure analysis (FA) of ICs in SiP (System-in-Package) module was often carried out blindly, for the shortage of failure analysis techniques. A failure analysis method combined with the fault tree analysis was introduced, and by taking the failure cases of IR PMOS, failure mechanism of ICs familiar in the SiP module were discussed, including electrical stress, thermal stress, mechanical damage and environmental stress. From the perspective of design and implementation, improvement measures to reduce the failure rate were proposed in the end.%由于分析手段与分析设备的限制，系统级封装（SiP）组件的芯片在失效分析的过程中带有一定的盲目性。结合故障树分析方法，以PM O S芯片失效为例，讨论了SiP组件常见的管芯失效机理：电应力失效、热应力失效、机械损伤和环境应力失效以及相应的失效现象；最后从设计和工艺角度提出了降低各种失效机理发生的改进措施。