大面积接地多层印制板焊接工艺研究

摘要

随着电子产品向密集化方向发展，多层印制板的应用越来越广泛。手工焊接带有大面积接地的多层板时，由于印制板大面积接地的特殊性，导致烙铁在焊接过程中热损失快、焊锡不能充分流动，从而无法完成焊接。针对此问题，采用一种新型的加热方式—预热板。通过工艺试验，寻找最佳匹配温控烙铁的预热板工艺参数，解决了此类印制板焊接难的问题。%With the development of electronic products to the direction of intensive, multi-layers PCB are adopted. Manual soldering multi-layers PCB with large grounding area is difficult because soldering iron heat loss is fast in the process of soldering, and solder is not fully flow. For this problem, adopt a new type of heating mode—preheat equipment. Through the technological test to find the best process parameters in the allowable range of GJB, solve soldering problem.