军用塑封电路分层及可靠性方法研究

摘要

It is well-known that Plastic Encapsulated Microcircuits(PEMs) offer special advantages of size, weight, cost, and availability, so that PEMs have been used more widely in the high reliability systems. But because of the characteristics of PEM in the aspects of material, structure and process, it often appear delamination problem during screening test. Describe the physical location of delamination by scanning acoustic microscope(SAM), and discuss the mechanism of delamination through analysis of thermal stress and moisture. The factors that should be considered when using PEMs in high reliability application are presented. In the last, the current research status of domestic military integrated circuits were summarized and prospected.%塑封电路以独具的优点使其在高可靠性领域的应用越来越广泛，但其在材料、结构和工艺方面的限制，使之极易发生分层现象。描述并分析了塑封电路在超声扫描检查中由分层导致的不合格问题。从热应力和湿气两方面探讨了分层产生的原因。给出了选用建议及提升塑封电路可靠性的解决方法。最后针对国内军用塑封集成电路可靠性研究现状进行了总结与展望。