弹载T/R组件电路板叠层组装技术

摘要

采用电路板叠层组装代替低温共烧陶瓷（LTCC）基板的方法能够大大降低T/R组件的制造成本，详细介绍了电路板叠层焊接技术在T/R组件生产中的应用，主要包括电路板清洗技术、电路板组装对位精度控制技术和大面积钎焊低空洞率控制技术，对T/R组件的生产具有一定的指导作用。%The way assembled micro-strip circuit boards by soldering instead of low temperature cofired ceramics (LTCC) board can reduce production cost of T/R module. Introduce detailedly the application of assembly technology for stacked micro-strip circuit boards in T/R module production, including cleaning technology, assembly precision control technology and the large area soldering technology for low voidage, which can give some guidance for T/R module production.