高功率多芯片组件的散热分析

摘要

使用Ansys软件对某高功率多芯片组件的芯片热分布进行了有限元分析;同时,对高功率多芯片组件在不同装配方式下芯片的热分布进行仿真分析,得出最优装配方案.通过仿真结果与红外热像仪的实测结果进行对比,表明使用Ansys仿真是进行散热分析与方案优化的可行手段,并明确了仿真分析在解决工程实践问题中的局限性.%Thermal field of chips in one multi-chip module(MCM) is analyzed using Ansys software by finite element method.Various assembly methods of MCM are simulated to define the optimized one.The results of thermal simulation are compared with the data measured by infrared thermal imaging,which shows the simulation using Ansys is a feasible way of thermal analysis and optimization.The limitations of finite element analyzing in engineering practice are also discussed.