BGA缩锡开裂现象形成机理分析与研究

摘要

BGA是一种非常好的封装,不仅封装密度高(I/0数多),而且焊接工艺性好,自发明以来得到广泛应用.但是,随着封装厚度与尺寸比的不断减小,BGA焊接过程中的动态变形越来越严重,这对BGA的焊接形成负面影响,从而出现了一些属于BGA的特定焊接不良现象,如枕头效应(HoP)、无润湿开焊(NWO)等.介绍一种BGA特定的焊接不良现象——BGA缩锡开裂,由于发生的概率比较小,业界没有看到报道.这种BGA缩锡开裂现象是作者首次在业界提出并命名的一种焊接不良现象.%BGA is a very good packaging,it is of not only high packaging density (more numbers of I/ 0),But also good soldering manufacturability.So BGA has been widely used.However,with the decrease of the ratio between thickness and size of the packaging,the dynamic deformation of BGA is becoming more serious during soldering,and have negative effect on BGA soldering,and some solder defects have happened,such as Head-of-Pillow (HoP),Non-Wet Open (NWO).Now introduce another defect of BGA,solder joint cracking with solder shrinking.The defect is not reported in the industry because of the probability is lesser.This kind of BGA defect is named first by the author,cracking with solder shrinking.