IGBT全自动装片机工艺方法研究

摘要

IGBT Die bond is used for back-end chip packing. Original IGBT packaging process is bonding the chip twice on two single die bond, it is easy to get oxidation and stress second release. The process refer to in this article is bonding two different chips at the same time. The process adopts dual bonding head, dual wafer table, double distinguish and double monitor system. It analyses the necessity, innovation and feasibility of IGBT die bond technology process.%　　IGBT全自动装片机是用于IGBT制造封装业中的后道封装工艺-固精工序。传统的封装工艺采用两台设备经过两次装片，两次加热，容易造成两次氧化的工艺、应力二次释放等问题。文章讨论的IGBT装片工艺是在一台设备上完成双芯片键合和焊料封装工序，实现IGBT器件的高速、精确装片，为了实现本工艺采用了双抓取、双Wafter平台技术，双识别、双监控系统等多项高端技术。文章从IGBT全自动装片机研究的必要性、工艺的创新性、可行性等几个方面进行了分析。