环氧模塑料中应力改质剂的使用讨论

摘要

In the process of semiconductor packaging, There are many reasons can cause delamination in package body, such as temperature, thermal expansion and stress. This study adds liquid stress modifier of epoxy molding compound to reduce thermal stress, and improve the delamination. The stress modifier include liquid and solid, in our study will focus on liquid modifier, and test more data of solid and liquid stress modifier in the use of the advantages and disadvantages.%半导体封装过程中,导致封装体发生分层的原因有很多,如温度的影响、材料热膨胀系数的影响、内应力影响等。文章主要研究通过添加应力改质剂来改善产品的内应力,从而改善分层的问题,应力改质剂主要可分为液体和固体,添加方式也各不一样。文中通过试验着重介绍液体应力改质剂以预溶的方式添加来改善环氧模塑料（Epoxy Molding Compound,EMC）的内应力,简单介绍固体应力改质剂的使用,同时试验比较固体和液体应力改质剂在使用上的利与弊。