This paper presents a new approach to design 1.25 SFP (Small Form Factor Pluggable) optical modules which is based on the chip of SEMTECH Company's GN25L95. Instead of using independent chips on the transmit circuit and receive circuit, this new scheme apples a single integrated chip on the PCBA, so that we can reduce the costs of the module. To verify the feasibility of the scheme, the comparative experiments have been made for the random samples of the new GN25L95 scheme, and an optical module which is used traditional scheme. And analyze their technical characters. The test results shows that, in the scope of industrial temperature (-40℃~+85℃), this approach is matched with the design requirements, its performance characters are consistent with the traditional scheme.%提出一种基于SEMTECH公司GN25L95芯片对于1.25G SFP(小型可插拔)光模块设计新方案。该方案在PC-BA电路上使用一片集成芯片代替传统发射与接收分别采用独立芯片的设计,从而降低模块成本。为了验证设计方案的可行性,对其随机抽样进行横向比较试验,并且与传统方案光模块进行对比试验,分析其技术指标。试验数据表明,该SFP光模块方案能在工业温度(-40℃~+85℃)范围内能符合设计要求,各项性能指标与采用独立芯片的传统方案一致。
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