[1]Department of Telecommunications Engineering, Yarmouk University, Irbid, Jordan [2]Department of Electrical Engineering and Cor~uter Sci The Catholic University of America, Washington, DC, USA [3]Huawei Research Center, Santa Clara, CA, USA [4]Huawei Technologies USA, Inc., Bridgewater, N J, USA [5]Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA;
[1]Department of Telecommunications Engineering, Yarmouk University, Irbid, Jordan [2]Department of Electrical Engineering and Cor~uter Sci The Catholic University of America, Washington, DC, USA [3]Huawei Research Center, Santa Clara, CA, USA [4]Huawei Technologies USA, Inc., Bridgewater, N J, USA [5]Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA;
[1]Department of Telecommunications Engineering, Yarmouk University, Irbid, Jordan [2]Department of Electrical Engineering and Cor~uter Sci The Catholic University of America, Washington, DC, USA [3]Huawei Research Center, Santa Clara, CA, USA [4]Huawei Technologies USA, Inc., Bridgewater, N J, USA [5]Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA;
[1]Department of Telecommunications Engineering, Yarmouk University, Irbid, Jordan [2]Department of Electrical Engineering and Cor~uter Sci The Catholic University of America, Washington, DC, USA [3]Huawei Research Center, Santa Clara, CA, USA [4]Huawei Technologies USA, Inc., Bridgewater, N J, USA [5]Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA;
[1]Department of Telecommunications Engineering, Yarmouk University, Irbid, Jordan [2]Department of Electrical Engineering and Cor~uter Sci The Catholic University of America, Washington, DC, USA [3]Huawei Research Center, Santa Clara, CA, USA [4]Huawei Technologies USA, Inc., Bridgewater, N J, USA [5]Department of Electrical and Computer Engineering, Michigan State University, East Lansing, MI, USA;
