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Chuangeng WAN; Huaping XIONG and Zhenfeng ZHOU (Dept. of Materials Science and Engineering; Jilin University of Technology; Changchun 130025; China)(To whom correspondence should be addressed);
Si; Ni; Wettability of CuNi-Ti Alloys on Si3N4 and Interfacial Reaction Products; Ti;
机译:Tai,mod UME台alto manufacture nano laminated alloy product
机译:Tai, mod UME台alto manufacture nano laminated alloy product
机译:Alloy Products分销Zultys IP PBX和UC产品
机译:study of Interfacial Reactions Between sn(Cu) solders and Ni-Co alloy Layers
机译:balanced AL-Cu-mg-SI alloy product
机译:NI-base alloy product
机译:AL-Cu-mg-SI alloy product
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