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Scaling and Removal of Calcium Carbonate on Electroless Plating Surface

机译:化学镀表面上碳酸钙的结垢和去除

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摘要

The scaling process of calcium carbonate on a low-energy heat transfer surface-electroless plating rnsurface was investigated in a simulated cooling water system. Owing to the very low surface energy, the electroless rnplating surface exhibited less scaling susceptibility. A longer induction period and a lower scaling rate were obtained rnon the low-energy surface compared to copper surface under identical conditions. The calcite particles obtained on rnthe electroless plating surface during the induction period were larger in size than those on copper surface because rnfewer crystals formed and grew at the same time on the low-energy surface. With increasing surface temperature, the rninduction period reduced and the scaling rate increased for the low-energy surface. When initial surface temperature rnwas fixed, an increase in fluid velocity would reduce the induction period and increase the scaling rate due to the rndiffusion effect. However, when the heat flux was fixed, an increase in fluid velocity would decrease the surfacerntemperature, and lead to a longer induction period and a lower scaling rate. The removal experiments of calcium rncarbonate scale indicated that during post induction period, the detachment was not obvious, while during the rninduction period, apparent removal of crystal particles was obtained on the electroless plating surface owing to the weak adhesion force. The more frequently the transient high hydrodynamic force acted, the more the detached crystal particles were.
机译:在模拟冷却水系统中研究了低能传热表面-化学镀表面上碳酸钙的结垢过程。由于非常低的表面能,化学镀后的镀层表面表现出较小的结垢敏感性。在相同条件下,与铜表面相比,低能表面具有更长的感应周期和更低的结垢率。在感应期间在化学镀表面上获得的方解石颗粒的尺寸比在铜表面上的方解石颗粒大,这是因为在低能表面上同时形成并生长了更少的晶体。随着表面温度的升高,低能表面的诱导周期缩短,结垢速率增大。当初始表面温度rn固定时,由于rn扩散效应,流体速度的增加将缩短诱导周期并增加结垢速率。然而,当热通量固定时,流体速度的增加将降低表面温度,并导致更长的诱导期和更低的结垢率。碳酸氢钙垢的去除实验表明,在诱导后阶段,剥离不明显,而在诱导期间,由于弱的粘附力,在化学镀表面上获得了明显的晶体颗粒去除。瞬态高水动力作用越频繁,分离的晶体颗粒越多。

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  • 来源
    《中国化学工程学报(英文版)》 |2001年第2期|150-155|共6页
  • 作者

  • 作者单位

    Institute of Refrigeration and Cryogenic Engineering, Shanghai Jiaotong University, Shanghai 200030,ChinarnInstitute of Chemical Engineering, Dalian University of Technology,;

    Institute of Chemical Engineering, Dalian University of Technology,;

    Dalian University of Technology,;

  • 收录信息 中国科学引文数据库(CSCD);中国科技论文与引文数据库(CSTPCD);
  • 原文格式 PDF
  • 正文语种 chi
  • 中图分类 化学;
  • 关键词

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