一种高折光率发光二极管封装硅树脂的研制

摘要

A novel high refractive index and high transparent silicone resin-type material for the packaging of light emitting diode ( LED) was introduced. The methylphenyl vinyl silicone resin was synthesized by cohydrolysis of MePhSiCl2 with Me2SiCl2, MeViSiCl2 and PhSiCl3, then by co-condensation polymerization catalyzed by KOH and end-capped with Me3SiCl. Then the silicone material for LED packaging was prepared with the produced methylphenyl vinyl silicone resin, methylphenyl hydrosilicone oil and Karstedt' s catalyst. The methylphenyl vinyl silicone resins were characterized by FTIR and 'H NMR. The silicone resins prepared with very high transmittance at range of 400-800 nm after cured. The LED packaged with the silicone resin-type materials exhibited higher luminous flux, higher light efficiency, narrower color-rendering index and higher color-temperature consistency.%将甲基苯基二氯硅烷( MePhSiCl2)与二甲基二氯硅烷(Me2 SiCl2)、甲基乙烯基二氯硅烷(MeViSiCl2)和苯基三氯硅烷( PhSiCl3)等共水解后,在KOH催化下共缩聚,以三甲基氯硅烷(Me3 SiCl)为封端剂,制备了含有甲基苯基硅氧链节的甲基苯基乙烯基硅树脂,并利用FTTR、1H NMR和热重分析(TGA)对产物进行了表征.将所得甲基苯基乙烯基硅树脂与甲基苯基含氢硅油按一定配比,在铂络合物催化下硫化成型,制成发光二极管(LED)封装A/B胶,用于LED封装.所得LED封装硅树脂固化后在可见光范围内具有非常高的透光率.对LED的封装结构进行优化,获得的LED具有高光效、高光通量、窄显色指数和高色温一致性等优点,可满足功率型LED封装要求.