多芯片 COB 封装 LED 的基板温度分布

摘要

The working temperature of a light-emitting diode ( LED) has a significant impact on its performance and lifetime.For multi-chip on board (COB) LED area illuminant, the non-uniform temperature distribution of package substrate is being concerned .This paper tries to solve the problem of multi-chip COB LED package substrate .The temperature distribution was simulated using the software ANSYS , and the reliability was verified by tested data . The temperature distributions on the substrate surface and in the thickness direction were discussed , respectively , and the temperature field of the aluminum substrate and that of copper substrate were compared .The results show that the temperature distribution of the chip concentration area on the package substrate is very uneven , whereas the temperature distribution in the edge region of the substrate is basically uniform .Substituting the aluminum substrate for copper substrate , the substrate temperature can be reduced , and the temperature gradient of the package sub-strate in the chip concentration area is also reduced;meanwhile the temperature uniformity of the copper substrate on the whole is better than that of the aluminum substrate .%发光二极管（LED）的工作温度对其性能和寿命有很大影响，对于多芯片板上贴装（COB）的LED面光源，还存在基板温度分布不均匀的问题。基于一款多芯片COB封装LED的封装基板，用ANSYS仿真分析软件模拟其温度场，并证实了模拟的可靠性，探讨了基板表面和厚度方向的温度分布情况，对比了铝基板和铜基板的温度场。结果表明，多芯片COB封装LED的基板温度分布在芯片集中区存在很大的不均匀性，而基板边缘区温度则基本均匀，用铜基板代替铝基板，可以降低基板温度，且芯片集中区基板温度梯度也减小，铜基板整体的温度分布均匀性要好于铝基板。