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Improvement of the Assembly between Cavity Flanges and the BCP Facility at IMP

机译:在腔法兰和BCP设施之间的改进

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摘要

The Buffered Chemical Polishing(BCP),consisting of one volume of 40%HF,one volume of 65%HNO_(3) and two volumes of 85%H_(3)PO_(4),has been considered as a popular method for etching the inner surfaces of niobium cavities after its fabrication,especially for lowβ(β<0.3)cavities.
机译:缓冲化学抛光(BCP),由一个体积为40%HF,1体积为65%HNO_(3)和两体积的85%H_(3)PO_(4),已被认为是用于蚀刻的普遍方法其制造后铌腔的内表面,特别是对于低β(β<0.3)腔。

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