The corrosion behavior of copper in 3% NaCl solutions has been investigated using AES. XPS and photoelectrochemical tectniques. The results show that Cl- has remarkable influence on the corrosion behavior of copper. With the increasing immersion time, the photoresponse of copper electrode changes from p-type to n-type gradually, and the invasion degree of Cl- ions on copper electrode increases. Finally, the band gap of the sedriconduct film formed on copper electrode surface is 1 .7eV.
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