Cu_(1.8-x)Sb_(x)S热电材料的相结构与电热输运性能

摘要

Cu_(1.8)S基热电材料因其丰富的原料储备、低毒性及优良的电学和热学性能而成为具有应用潜力的热电材料.本文采用机械合金化(mechanical alloying,MA)结合放电等离子烧结(spark plasma sintering,SPS)工艺制备了一系列Cu_(1.8–x)Sb_(x)S(x=0,0.005,0.02,0.03,0.04)块体材料,研究了不同Sb掺杂量对Cu_(1.8–x)Sb_(x)S相结构、微观形貌及热电性能的影响.结果表明,随着Sb含量的增加,Cu_(1.8–x)Sb_(x)S材料相结构由单相Cu1.8S转变为多相共存,其块体均呈p型导电特征.样品Cu_(1.77)Sb_(0.03)S在723 K时取得最高ZT值约为0.37,比未掺杂Cu_(1.8)S(0.33)提高了12%.