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INTERDIFFUSION OF ELECTRODEPOSITS WITH THEIR SUBSTRATES AND DIFFUSION-INDUCED GRAIN BOUNDARY MIGRATION (ELECTROPLATING, KINETICS, SOLID SOLUBILITY, MICROSTRUCTURE)

机译：电沉积物与其基质的相互扩散和扩散引起的颗粒边界迁移（电沉积，动力学，固体溶解度，微观结构）

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作者
KAJA, SURYANARAYANA;
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作者单位

The Pennsylvania State University;

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授予单位 The Pennsylvania State University;
学科
学位 Ph.D.
年度 1985
页码 226 p.
总页数 226
原文格式 PDF
正文语种 eng
中图分类
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专利

1. Chemical driving force for diffusion-induced recrystallization or diffusion-induced grain boundary migration in a binary system consisting of nonvolatile elements [J] . M. Kajihara Scripta materialia . 2006,第10期

机译：由非挥发性元素组成的二元体系中扩散诱导的再结晶或扩散诱导的晶界迁移的化学驱动力
2. Interdiffusion along grain boundaries - Diffusion induced grain boundary migration, low temperature homogenization and reactions in nanostructured thin films [J] . Beke D. L., Kaganovskii Yu., Katona G. L. Progress in Materials Science . 2018,第OCTa期

机译：沿晶界的互扩散-扩散引起的晶界迁移，低温均质化和纳米结构薄膜中的反应
3. Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints [J] . Ousama M. Abdelhadi, Leila Ladani Journal of Electronic Packaging . 2013,第2期

机译：焊缝尺寸对固液互扩散Sn3.5Ag / Cu-基钎料焊缝中金属间化合物微结构和生长动力学的影响
4. The effect of diffusion-induced grain boundary migration ahead of SCC crack tips on propagation [C] . Zhao Shen, Koji Arioka, Sergio Lozano-Perez International Conference on Environmental Degradation of Materials in Nuclear Power Systems - Water Reactors . 2019

机译：扩散诱导的晶界迁移在传播中SCC裂缝提示的影响
5. Diffusion-induced grain boundary migration (DIGM) and liquid film migration (LFM) in an aluminum-copper alloy [D] . Kuo, Minghuei 1990

机译：铝铜合金中扩散引起的晶界迁移（DIGM）和液膜迁移（LFM）
6. Reconciling grain growth and shear-coupled grain boundary migration [O] . Spencer L. Thomas, Kongtao Chen, Jian Han, -1

机译：调和晶粒长大和剪切耦合的晶界迁移
7. Interdiffusion and Grain-Boundary Migration in Au/Cu Bilayers During Ion-Irradiation [O] . Dale E. Alexander, L. E. Rehn, Peter M. Baldo 1991

机译：离子辐射期间Au / Cu双层的相互作用和晶界迁移
8. Mechanisms and Kinetics of Surface Alloying by Diffusion-Induced Grain Boundary Migration [R] . Manning, J. R., Cahn, J. W., Butrymowicz, D. B., 1985

机译：扩散诱导晶界迁移表面合金化的机理和动力学

INTERDIFFUSION OF ELECTRODEPOSITS WITH THEIR SUBSTRATES AND DIFFUSION-INDUCED GRAIN BOUNDARY MIGRATION (ELECTROPLATING, KINETICS, SOLID SOLUBILITY, MICROSTRUCTURE)

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