Development of High Power Density Micro-Thermoelectric Generators

摘要

Thermoelectric generators (TEGs) are promising for the waste heat recovery in virtue of the ability to directly convert heat to electricity. Despite of their relatively low energy conversion efficiency, TEGs have many advantages including high reliability, long lifetime, and environmental friendliness. Especially, compared to conventional heat engines, TEGs are compact, scalable, and can be easily driven by small temperature differences. Potential applications of TEGs include thermal sensing, thermal management, and thermal energy harvesting to power wireless sensors and microelectronic devices such as wearable medical sensors and wristwatches.;This dissertation presents my work on development of high power density non-flexible and flexible micro-TEGs for thermal energy harvesting in the ambient environment. Micro- TEGs are developed by a bottom-up approach combing electroplating and microfabrication processes. Pulsed electroplating is mainly adopted to deposit thermoelectric materials in the device fabrication. First, I collaborated with Dr. Zhou in our lab and systematically studied the effect of deposition parameters on composition, microstructure, and thermoelectric properties of the electroplated Bi2Te3 and Sb2 Te3 thin films. We demonstrated that thermoelectric properties of both Bi2Te3 and Sb2Te3 films can be enhanced by tuning the pulse off-to-on ratio.;After the fundamental study on the deposition conditions, morphology, and thermoelectric properties of the electroplated materials, we fabricated a high power density cross-plane micro-TEG on the SiO2/Si substrate by integrating the pulsed electroplating with microfabrication processes. The TEG consists of a total of 127 pairs of n-type Bi2Te3 and ptype Sb2Te3 thermoelectric pillars embedded in a SU-8 matrix to enhance the overall mechanical strength of the device. Both bottom and top electrical connections are formed by electroplating, which is advantageous because of facile and low cost fabrication and low parasitic electrical resistances. The device demonstrates a maximum power of 2990 muW at a temperature difference of 52.5 K, corresponding to a power density as high as 9.2 mW cm-2. The power density of our device is more than two times the highest value reported for the electroplated micro-TEGs in the literature, which can be attributed to the low internal resistance and high packing density of thermoelectric pillars.;Based on my work on non-flexible micro-TEGs, I further modified the device fabrication process and developed an ultra-light high power density flexible micro-TEG. The flexible TEG demonstrates excellent flexibility. No obvious electrical resistance change was observed after bending to a curvature as small as 5 mm for 600 times. The flexible micro-TEG we developed demonstrates a maximum power of 1.5 mW at a temperature difference of 50.7 K, corresponding to a power density of 4.5 mW cm-2. More importantly, the flexible TEG is ultra-light and an unprecedentedly high power per unit mass of 60 mW g-1 is achieved, which might be beneficial for wearable technology.