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Manufacturable millimeter-wave gallium arsenide MESFET integrated circuit technology.

机译:可制造的毫米波砷化镓镓MESFET集成电路技术。

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摘要

This work will analyze the development of a GaAs MESFET-based IC process technology for LSI integrated circuits. It is the aim of this work to achieve a process technology capable of sustaining millimeter-wave LSI 0.25-0.10 {dollar}mu{dollar}m ion implanted GaAs MESFET coplanar waveguide integrated circuits. These devices are vital for the realization of viable consumer products in the hand-held personal communication market and other communication and commercial radar applications.; A detailed description of the process utilized for fabricating 0.25 {dollar}mu{dollar}m T-gate structures using electron-beam lithography is the focus of this work. The physical characteristics and electrical measurements which assist in the development and verification of this process technology are described in detail.; Speed, noise and gain measurements are reviewed for discrete and monolithic millimeter-wave and digital ICs. Future plans for low-noise 0.10 {dollar}mu{dollar}m T-gate FETs using ion-implantation and electron-beam lithography techniques are also discussed.
机译:这项工作将分析用于LSI集成电路的基于GaAs MESFET的IC处理技术的发展。这项工作的目的是实现一种能够维持0.25-0.10 mm的离子注入GaAs MESFET共面波导集成电路的毫米波LSI的处理技术。这些设备对于在手持个人通信市场以及其他通信和商业雷达应用中实现可行的消费产品至关重要。这项工作的重点是使用电子束光刻技术制造0.25μmT栅结构的过程的详细描述。详细描述了有助于开发和验证该工艺技术的物理特性和电气测量。审查了离散和单片毫米波和数字IC的速度,噪声和增益测量。还讨论了使用离子注入和电子束光刻技术的低噪声0.10μmT栅FET的未来计划。

著录项

  • 作者

    Apostolakis, Peter J.;

  • 作者单位

    University of Illinois at Urbana-Champaign.;

  • 授予单位 University of Illinois at Urbana-Champaign.;
  • 学科 Engineering Electronics and Electrical.; Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 1996
  • 页码 112 p.
  • 总页数 112
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;工程材料学;
  • 关键词

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