Monolithic etched-facet triangular waveguide diode ring laser arrays for hybrid optical packages using passive alignment.

摘要

This thesis investigates hybrid integration of diode lasers onto Si motherboards. Precision etched V-grooves allow fiber coupling onto and off the motherboard, and electrical transmission lines defined in metal layers deposited on the motherboard allow electrical interconnection. This thesis describes the processing steps used to fabricate, solder jet, and flip-chip bond GaAs Waveguide Diode Ring Laser arrays to Si motherboards using passive alignment.;The significant feature of the "entirely passive" alignment is self-alignment of the top-mounted optical chips due to the surface tension of the molten solder, thus eliminating the need for painstaking adjustments of chip positioning for coupling to optical waveguides and/or fibers on the optoelectronic circuit boards. Noteworthy features of this novel solder deposition technique are minute, easily placeable, and reproducible size of solder bumps (;Precision V-grooves for guiding fibers and solder bumps on metallized pads for accurate optical chip placement have been fabricated on Si substrates by using an anisotropic chemical etchant, reactive ion etching, evaporation, and solder jetting systems. The best array/solder ball alignment scheme on the area available was incorporated in the design using Ti = 100A, Pd = 800A, and Au = 2000A 100