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Chemical Vapor Deposition of Metastable Germanium Based Semiconductors for Optoelectronic Applications.

机译:用于光电子应用的亚稳锗基半导体的化学气相沉积。

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摘要

Optoelectronic and microelectronic applications of germanium-based materials have received considerable research interest in recent years. A novel method for Ge on Si heteroepitaxy required for such applications was developed via molecular epitaxy of Ge5H12. Next, As(GeH 3)3, As(SiH3)3, SbD3, S(GeH 3)2 and S(Si3)2 molecular sources were utilized in degenerate n-type doping of Ge. The epitaxial Ge films produced in this work incorporate donor atoms at concentrations above the thermodynamic equilibrium limits. The donors are nearly fully activated, and led to films with lowest resistivity values thus far reported.;Band engineering of Ge was achieved by alloying with Sn. Epitaxy of the alloy layers was conducted on virtual Ge substrates, and made use of the germanium hydrides Ge2H6 and Ge3H8, and the Sn source SnD4. These films exhibit stronger emission than equivalent material deposited directly on Si, and the contributions from the direct and indirect edges can be separated. The indirect-direct crossover composition for Ge1-ySn y alloys was determined by photoluminescence (PL). By n-type doping of the Ge1-ySn y alloys via P(GeH3)3, P(SiH3) 3 and As(SiH3)3, it was possible to enhance photoexcited emission by more than an order-of-magnitude.;The above techniques for deposition of direct gap Ge1- ySny alloys and doping of Ge were combined with p-type doping methods for Ge1- ySny using B2H 6 to fabricate pin heterostructure diodes with active layer compositions up to y=0.137. These represent the first direct gap light emitting diodes made from group IV materials. The effect of the single defected n-i interface in a n-Ge/ i-Ge1-ySny/p-Ge 1-zSnz architecture on electroluminescence (EL) was studied. This led to lattice engineering of the n-type contact layer to produce diodes of n-Ge 1-xSnx/ i-Ge1-ySny/ p-Ge1-zSnz architecture which are devoid of interface defects and therefore exhibit more efficient EL than the previous design. Finally, n-Ge 1-ySny/ p-Ge1-zSnz pn junction devices were synthesized with varying composition and doping parameters to investigate the effect of these properties on EL.
机译:近年来,锗基材料的光电子和微电子应用受到了相当大的研究兴趣。通过Ge5H12的分子外延技术,开发了此类应用所需的Ge硅异质外延新方法。接下来,利用As(GeH 3)3,As(SiH 3)3,SbD 3,S(GeH 3)2和S(Si 3)2分子源进行Ge的简并n型掺杂。在这项工作中生产的外延Ge膜以高于热力学平衡极限的浓度结合了供体原子。施主几乎被完全活化,并导致迄今报道的具有最低电阻率值的薄膜。锗的波段工程化是通过与锡合金化而实现的。合金层的外延在虚拟Ge衬底上进行,并使用氢化锗Ge2H6和Ge3H8以及Sn源SnD4。这些薄膜比直接沉积在Si上的等效材料具有更强的发射能力,并且可以分离来自直接边缘和间接边缘的贡献。通过光致发光(PL)确定Ge1-ySn y合金的间接-直接交叉组成。通过通过P(GeH3)3,P(SiH3)3和As(SiH3)3对Ge1-ySn y合金进行n型掺杂,可以将光激发发射增强一个数量级以上。将直接间隙Ge1-ySny合金的沉积和Ge的掺杂的上述技术与使用B2H 6的Ge1-ySny的p型掺杂方法相结合,以制造具有y = 0.137的活性层组成的pin异质结构二极管。这些代表了由IV组材料制成的第一个直接间隙发光二极管。研究了n-Ge / i-Ge1-ySny / p-Ge 1-zSnz结构中单个缺陷n-i界面对电致发光(EL)的影响。这导致对n型接触层进行晶格工程,以生产n-Ge 1-xSnx / i-Ge1-ySny / p-Ge1-zSnz架构的二极管,这些二极管没有界面缺陷,因此比以前的LED效率更高设计。最后,合成了具有不同组成和掺杂参数的n-Ge 1-ySny / p-Ge1-zSnz pn结器件,以研究这些性质对EL的影响。

著录项

  • 作者单位

    Arizona State University.;

  • 授予单位 Arizona State University.;
  • 学科 Inorganic chemistry.;Electrical engineering.;Theoretical physics.
  • 学位 Ph.D.
  • 年度 2016
  • 页码 270 p.
  • 总页数 270
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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