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Experimental Study of Pool Boiling Heat Transfer Enhancement over Microchanneled Surfaces.

机译:微通道表面池沸腾传热增强的实验研究。

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摘要

Pool boiling is of interest in heat transfer applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is still not comparable to the cooling ability provided by enhanced microchannels operating under single-phase conditions. This investigation focuses on the bubble dynamics and heat transfer on plain and structured microchanneled surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism through the use of a high speed camera.;In a preliminary study, silicon chips have been tested in the nucleate boiling regime, and beneficial microchannel geometries have been identified. It is determined that heat transfer enhancement occurs because of (i) an increase in surface area and (ii) an improvement in the heat transfer mechanism through the channels functioning as liquid conduits for three side heating. The range for channel size in which the greatest enhancement occurs has been identified as being 200 -- 400 mum width and 300 -- 500 mum depth.;The second study has been investigated with copper chips, with improvements to the test setup for accurate measurement of surface temperature. Ten chips, in addition to a plain chip have been evaluated for heat transfer performance. It has been determined that surfaces with many, small hydraulic diameter channels enhance the heat transfer as well as surfaces with wide and deep channels. The best performing chip had a record heat transfer coefficient of 269 kW/m2K. The large heat fluxes of over 240 W/cm2 were attained without reaching the critical heat flux condition, because of the open channels on the surface acting as conduits for liquid supply to the nucleation sites. The microchannels prevent surface dryout and critical heat flux (CHF), while the channel width controls the size of the departing bubbles.
机译:池沸腾在传热应用中是令人关注的,因为它有潜力去除大量蒸发潜热所产生的热量,并且对冷却剂在系统中循环的压降影响很小。但是,池沸腾系统的传热性能仍无法与在单相条件下运行的增强型微通道所提供的冷却能力相比。这项研究的重点是在各种热通量下的平整和结构化微通道表面上的气泡动力学和传热,旨在通过使用高速摄像机来了解潜在的传热机理。在初步研究中,已经对硅芯片进行了测试在核沸腾过程中,已经确定了有利的微通道几何形状。可以确定,由于(i)表面积的增加和(ii)通过用作三侧加热的液体导管的通道的传热机理的改善,导致传热增强。可以确定最大增强的通道尺寸范围为200-400毫米宽度和300-500毫米深度;第二项研究是使用铜芯片进行的,对测试装置进行了改进以实现精确测量表面温度。除普通芯片外,还评估了十个芯片的传热性能。已经确定,具有许多小的水力直径通道的表面以及具有宽而深的通道的表面都增强了热传递。表现最佳的芯片的传热系数为269 kW / m2K。由于表面上的开放通道充当向成核位点供应液体的管道,因此在没有达到临界热通量条件的情况下获得了超过240 W / cm2的大热通量。这些微通道可防止表面变干和临界热通量(CHF),而通道宽度则控制着气泡的大小。

著录项

  • 作者

    Cooke, Dwight.;

  • 作者单位

    Rochester Institute of Technology.;

  • 授予单位 Rochester Institute of Technology.;
  • 学科 Engineering Mechanical.
  • 学位 M.S.
  • 年度 2011
  • 页码 86 p.
  • 总页数 86
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 公共建筑;
  • 关键词

  • 入库时间 2022-08-17 11:45:02

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