Aerosol-based ultrafine material deposition for microelectronics.

摘要

Aerosol-based direct-write refers to the additive process of printing CAD/CAM features from an apparatus which creates a liquid or solid aerosol beam. Direct-write technologies are poised to become useful tools in the microelectronics industry for rapid prototyping of components such as interconnects, sensors and thin film transistors (TFTs), with new applications for aerosol direct-write being rapidly conceived. This research aims to review direct-write technologies, with an emphasis on aerosol based systems. The different currently available state-of-the-art systems such as Aerosol Jet™ CAB-DW™, MCS and aerodynamic lenses are described. A review and analysis of the physics behind the fluid-particle interactions including Stokes and Saffman force, experimental observations and how a full understanding of theory and experiments can lead to new technology such as nozzle designs are presented. Finally, the applications of aerosol direct-write for microelectronics are discussed in detail including the printing of RFID antennas, contacts and active material for TFTs, the top metallization layer for solar cells, and interconnects for circuitry.