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Spark plasma sintering of monolithic silicon carbide and silicon carbide-graphene composite.

机译:整体碳化硅和碳化硅-石墨烯复合材料的火花等离子体烧结。

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摘要

Ball milled α – SiC (2.73 µm) was consolidated rapidly using spark plasma sintering at 1800, 1900, and 2000 °C under 90 MPa pressure and 20 min of soaking time. Relatively high densification (>90% relative density) was achieved at 2000 °C. The densification stages were identified, and a three stage densification process was proposed. The formal densification study was performed using the model proposed by Ashby, and the dominant mechanism for densification was determined to be grain boundary accommodated diffusion controlled creep. The formal grain growth mechanism was also investigated, and similar result was found. The value of stress exponent was calculated as 1.1, and the activation energy needed for final stage densification was found to be ≈ 427 - 500 KJ/mol. Also, nano-grain clustering was identified as an auxiliary mechanism from microstructural analysis.;The reinforcement of SiC was done with 1, 2, and 3 vol.% graphene. Mechanical characterizations were performed on the reinforced ceramics, and inter-granular fracture was seen. Graphene didn't cause any improvement in hardness of SiC, but showed substantial improvement in flexural strength. Graphene proved to be very useful in restraining grain growth, but decreased the density of monolithic SiC.
机译:球磨α-SiC(2.73 µm)通过在1800、1900和2000°C下在90 MPa压力和20分钟均热时间下通过火花等离子体烧结快速固结。在2000°C下获得了相对较高的致密化(> 90%相对密度)。确定了致密化阶段,并提出了三个阶段的致密化过程。正式的致密化研究是使用Ashby提出的模型进行的,致密化的主要机制被确定为晶界容纳的扩散控制蠕变。还研究了正式的晶粒长大机理,并发现了相似的结果。应力指数的值经计算为1.1,发现最终致密化所需的活化能为≈。 427-500 KJ / mol。此外,通过微观结构分析,纳米颗粒的聚集被认为是辅助机制。SiC的增强是用1、2和3%(体积)的石墨烯完成的。在增强陶瓷上进行了机械表征,并观察到晶间断裂。石墨烯并未使SiC的硬度有任何改善,但抗弯强度却显示出实质性的改善。石墨烯被证明对抑制晶粒长大非常有用,但是却降低了整体SiC的密度。

著录项

  • 作者单位

    Oklahoma State University.;

  • 授予单位 Oklahoma State University.;
  • 学科 Engineering Mechanical.;Engineering Materials Science.
  • 学位 M.S.
  • 年度 2013
  • 页码 111 p.
  • 总页数 111
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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