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Silicon Based Uncooled Microbolometer

机译:硅基非制冷测微仪

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摘要

During the last decade, uncooled microbolometer infrared detectors have attracted the attention of military and civilian infrared detection and imaging industry due to their significant advantages. In actuality, infrared imaging systems play a critical role in sectors such as thermography (predictive maintenance and building inspection), commercial and civilian applications (vision automotive, surveillance, navigation and fire-fighting), and defense industry (thermal weapon sight, soldier vision and vehicle vision enhancer). Compared with the cryogenically cooled infrared photon detectors, uncooled infrared imaging technology offers advantages such as operation at room temperature, light weight and size, reduced power consumption, easy integration with read-out electronics and broadband response capability.;The motivation for this study is the consideration of silicon as an alternative candidate to replace the standard infrared detector thermosensing materials, as a result of its low cost and easy integration with the actual silicon planar lithography microfabrication techniques. No prior attempts are known in the literature on the use of low doped p-type silicon (p-Si) as a thermosensing material in thermal infrared detectors.;The main aim of this research work is the design, modeling and simulation of low doped p-Si based uncooled microbolometer infrared detector. The theoretical optical modeling, and electronic performance are analyzed and explained. Radiative properties, as function of thin film thickness, of some commonly used thin films of dielectric materials, aluminum oxide (Al2O3), silicon dioxide (SiO2), aluminum nitride (AlN) and silicon nitride (Si3N4) are investigated within the infrared spectral range of 1.5--14.2 microm.;A novel thermally isolated, suspended square-shaped multilayer structure microbolometer is proposed. Its radiative properties are simulated and optimized in the long wavelength spectral range of 8--14 microm (transmission window at room temperature). The performance of the proposed microbolometer structure is numerically calculated by the figures of merit that characterize the thermal detector response. The dimensions of the microbolometer structure are optimized in order to achieve the maximum responsivity and low thermal time response required by the imaging systems, while securing the stability and support of the structure.
机译:在过去的十年中,未冷却的微辐射热计红外探测器由于其显着的优势而引起了军事和民用红外探测和成像行业的关注。实际上,红外成像系统在热成像(预测性维护和建筑物检查),商业和民用应用(视觉汽车,监视,导航和消防)以及国防工业(热武器瞄准器,士兵视觉)中起着至关重要的作用。和车辆视觉增强器)。与低温冷却的红外光子探测器相比,非冷却红外成像技术具有诸如在室温下操作,重量轻,尺寸小,功耗降低,易于与读出电子设备集成以及宽带响应能力等优点。由于硅价格低廉且易于与实际的硅平面光刻微加工技术集成,因此考虑将硅作为替代标准红外探测器热敏材料的替代材料。在文献中没有关于使用低掺杂p型硅(p-Si)作为热红外探测器中的热敏材料的先前尝试。该研究工作的主要目的是低掺杂的设计,建模和仿真。基于p-Si的非冷却微辐射热计红外探测器。分析并解释了理论光学建模和电子性能。在红外光谱范围内研究了一些常用介电材料,氧化铝(Al2O3),二氧化硅(SiO2),氮化铝(AlN)和氮化硅(Si3N4)薄膜的辐射特性,作为薄膜厚度的函数1.5--14.2微米。;提出了一种新型的热隔离悬浮方形多层结构测微辐射热计。它的辐射特性在8--14微米长波长光谱范围(室温下的透射窗口)内进行了模拟和优化。拟议的测微辐射热计结构的性能由表征热探测器响应的品质因数进行数值计算。优化了微辐射热计结构的尺寸,以实现成像系统所需的最大响应度和较低的热时间响应,同时确保结构的稳定性和支撑性。

著录项

  • 作者

    Bañobre, Asahel.;

  • 作者单位

    New Jersey Institute of Technology.;

  • 授予单位 New Jersey Institute of Technology.;
  • 学科 Materials science.;Physics.;Electrical engineering.
  • 学位 Ph.D.
  • 年度 2018
  • 页码 135 p.
  • 总页数 135
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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