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Methane-hydrogen low energy electron enhanced etching (LE4) of mercury cadmium telluride.

机译:碲化汞镉的甲烷氢低能电子增强蚀刻(LE4)。

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摘要

Low energy electron enhanced etching (LE4) is applied to HgCdTe with methane (CH4) and hydrogen (H2) process gas to eliminate ion-induced surface damage. The LE4 results from photoresist (PR) mesa patterned HgCdTe samples illustrate that LE4 successfully etches patterns into HgCdTe with good anisotropy and smooth surface. The competition between pure LE4 and polymer deposition under LE4 process of HgCdTe is studied in terms of three etch variables: electron energy (sample bias), CH4 concentration (gas composition), and sample temperature.;In order to understand polymer deposition separately from the overall LE4 process, plasma polymerization experiments are performed on a tantalum (Ta) substrate with Ar (90%) and CH4 (10%) dc plasma. The results show reduction in polymer as the electron or ion energy and the substrate temperature increase.;From the study in terms of the three etch variables, reduction in Cd accumulation, smooth surface and minimal polymer are obtained at high electron energy: 30 V dc bias relative to earth (dc bias range: -29--30 V relative to earth) with 0.05% CH4 and sample temperature of room temperature for unpattemed HgCdTe sample. By calculation using Langmuir probe measurement and plasma sheath analysis, the electron energy values are 9-21 eV at bias values of 0, 10, 20, and 30 V relative to earth. The etch yields are 0.01-0.05 atom/electron for those electron energy values.;Smooth surface and minimal polymer are obtained at low CH4 concentration: 0.05%-2% CH4 with various do bias and sample temperature conditions for unpatterned and PR mesa patterned HgCdTe samples. High etch rate and smooth surface are obtained at the sample temperature of 60°C. Thermal desorption of Hg occurs above 60°C in these etching experiments.
机译:低能电子增强蚀刻(LE4)与甲烷(CH4)和氢气(H2)工艺气体一起应用于HgCdTe,以消除离子引起的表面损伤。从光刻胶(PR)台面图案化的HgCdTe样品得到的LE4结果表明,LE4成功地将图案蚀刻成具有良好各向异性和光滑表面的HgCdTe。从三个刻蚀变量研究了纯LE4和在HgCdTe的LE4处理下聚合物沉积之间的竞争:电子能量(样品偏压),CH4浓度(气体成分)和样品温度三个蚀刻变量;在整个LE4工艺中,在钽(Ta)基板上进行Ar(90%)和CH4(10%)直流等离子体的等离子体聚合实验。结果表明,随着电子或离子能量的增加,聚合物的含量降低,并且衬底温度升高。;根据三个蚀刻变量的研究,在高电子能量:30 V dc时,Cd的积聚减少,表面光滑且聚合物最少对于未定型的HgCdTe样品,其相对于大地的偏压(相对于大地的直流偏压范围:相对于大地的-29--30 V)和室温下的样品温度为室温。通过使用Langmuir探针测量和等离子体鞘分析进行计算,相对于地球的偏置值为0、10、20和30 V,电子能量值为9-21 eV。对于那些电子能量值,蚀刻产率为0.01-0.05原子/电子。;在低CH4浓度下获得光滑的表面和最少的聚合物:0.05%-2%CH4,并具有各种图案偏压和样品温度条件,用于无图案和PR台面图案的HgCdTe样品。在60°C的样品温度下可获得高蚀刻速率和光滑表面。在这些蚀刻实验中,Hg的热脱附在60°C以上发生。

著录项

  • 作者

    Kim, Jae Hwa.;

  • 作者单位

    University of California, Los Angeles.;

  • 授予单位 University of California, Los Angeles.;
  • 学科 Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2007
  • 页码 110 p.
  • 总页数 110
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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